View MC74AC125DTR2G_687247.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

MC74AC125, MC74ACT125 Quad Buffer with 3-State Outputs
Features
* Outputs Source/Sink * ACT125 Has TTL Compatible Inputs * Pb-Free Packages are Available
http://onsemi.com
VCC 14
A2 13
B2 12
O2 11
A3 10
B3 9
O3 8
14 1
PDIP-14 N SUFFIX CASE 646
14 1 A0 2 B0 3 O0 4 A1 5 B1 6 O1 7 GND 1
SOIC-14 D SUFFIX CASE 751A
Figure 1. Pinout: 14-Lead Packages Conductors (Top View)
14 1
TSSOP-14 DT SUFFIX CASE 948G
PIN ASSIGNMENT
PIN An, Bn On FUNCTION Inputs Outputs 14 1 SOEIAJ-14 M SUFFIX CASE 965
FUNCTION TABLE
Inputs An Bn Output On L H Z
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.
L L L H H X NOTE: H = High Voltage Level; L = Low Voltage Level; Z = High Impedance; X = Immaterial
DEVICE MARKING INFORMATION
See general marking information in the device marking section on page 5 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2006
October, 2006 - Rev. 7
1
Publication Order Number: MC74AC125/D
MC74AC125, MC74ACT125
MAXIMUM RATINGS
Symbol VCC Vin Vout Iin Iout ICC Tstg Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Sink/Source Current, per Pin DC VCC or GND Current per Output Pin Storage Temperature Value -0.5 to +7.0 -0.5 to VCC + 0.5 -0.5 to VCC + 0.5 20 50 50 -65 to +150 Unit V V V mA mA mA C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC Vin, Vout tr, tf TJ TA IOH IOL Supply Voltage DC Input Voltage, Output Voltage (Ref. to GND) Input Rise and Fall Time (Note 1) AC Devices except Schmitt Inputs Junction Temperature (PDIP) Operating Ambient Temperature Range Output Current - HIGH Output Current - LOW VCC @ 3.0 V VCC @ 4.5 V VCC @ 5.5 V Parameter AC ACT Min 2.0 4.5 0 - - - - -40 - - Typ 5.0 5.0 - 150 40 25 - 25 - - Max 6.0 5.5 VCC - - - 140 85 -24 24 C C mA mA ns/V Unit V V
1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
http://onsemi.com
2
MC74AC125, MC74ACT125
DC CHARACTERISTICS
74AC Symbol Parameter VCC (V) TA = +25C Typ 1.5 2.25 2.75 1.5 2.25 2.75 2.99 4.46 5.49 - - - 0.002 0.001 0.001 - - - - - - - - 74AC TA = -40C to +85C Unit Conditions
VIH
Minimum High Level Input Voltage Maximum Low Level Input Voltage Minimum High Level Output Voltage
VIL
VOH
3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5
Guaranteed Limits 2.1 2.1 3.15 3.15 3.85 3.85 0.9 0.9 1.35 1.35 1.65 1.65 2.9 2.9 4.4 4.4 5.4 5.4 2.56 3.86 4.86 0.1 0.1 0.1 0.36 0.36 0.36 0.1 2.46 3.76 4.76 0.1 0.1 0.1 0.44 0.44 0.44 1.0
V
VOUT = 0.1 V or VCC - 0.1 V VOUT = 0.1 V or VCC - 0.1 V IOUT = - 50 mA
V
V
V
VOL
Minimum Low Level Output Voltage
V
*VIN = VIL or VIH -12 mA IOH - 24 mA - 24 mA IOUT = 50 mA
V
IIN IOZ
Maximum Input Leakage Current VI (OE) = VIL, VIH VI = VCC, GND VO = VCC , GND Minimum Dynamic Output Current Maximum Quiescent Supply Current
5.5 5.5 5.5 5.5 5.5
mA mA mA mA mA
*VIN = VIL or VIH 12 mA IOL 24 mA 24 mA VI = VCC, GND VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND
0.5 - - 8.0
5.0 75 -75 80
IOLD IOHD ICC
*All outputs loaded; thresholds on input associated with output under test. Maximum test duration 2.0 ms, one input loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V.
AC CHARACTERISTICS
74AC Symbol Parameter VCC* (V) TA = +25C CL = 50 pF Min 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Max 9.0 7.0 9.0 7.0 10.5 7.0 10 8.0 10 9.0 10.5 9.0 74AC TA = -40C to +85C CL = 50 pF Min 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Max 10 7.5 10 7.5 11 8.0 11 8.5 10.5 9.5 11.5 9.5 Unit
tPLH tPHL tPZH tPZL tPHZ tPLZ
Propagation Delay Data to Output Propagation Delay Data to Output Output Enable Time Output Enable Time Output Disable Time
Output Disable Time *Voltage Range 3.3 V is 3.3 V 0.3 V. Voltage Range 5.0 V is 5.0 V 0.5 V.
3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0
ns ns ns ns ns ns
http://onsemi.com
3
MC74AC125, MC74ACT125
DC CHARACTERISTICS
74ACT Symbol Parameter VCC (V) TA = +25C Typ 1.5 1.5 1.5 1.5 4.49 5.49 - - 0.001 0.001 - - - - 0.6 - - 74ACT TA = -40C to +85C Unit Conditions
VIH VIL VOH
Minimum High Level Input Voltage Maximum Low Level Input Voltage Minimum High Level Output Voltage
4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5 4.5 5.5
Guaranteed Limits 2.2 2.0 2.0 2.0 0.8 0.8 0.8 0.8 4.4 4.4 5.4 5.4 3.86 4.86 0.1 0.1 0.36 0.36 0.1 0.5 - - - 8.0 3.76 4.76 0.1 0.1 0.44 0.44 1.0 5.0 1.5 75 -75 80
V V V V V V mA mA mA mA mA mA
VOUT = 0.1 V or VCC - 0.1 V VOUT = 0.1 V or VCC - 0.1 V IOUT = - 50 mA *VIN = VIL or VIH - 24 mA IOH - 24 mA IOUT = - 50 mA *VIN = VIL or VIH IOH - 24 mA - 24 mA VI = VCC, GND VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND VI = VCC - 2.1 V VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND
VOL
Minimum Low Level Output Voltage
IIN IOZ
Maximum Input Leakage Current VI (OE) = VIL, VIH VI = VCC, GND VO = VCC , GND Additional Max. ICC/Input Minimum Dynamic Output Current
5.5 5.5 5.5 5.5 5.5
DICCT IOLD IOHD
ICC Maximum Quiescent Supply Current 5.5 - *All outputs loaded; thresholds on input associated with output under test. Maximum test duration 2.0 ms, one input loaded at a time.
AC CHARACTERISTICS
74ACT Symbol Parameter VCC* (V) TA = +25C CL = 50 pF Min tPLH tPHL tPZH tPZL tPHZ tPLZ Propagation Delay Data to Output Propagation Delay Data to Output Output Enable Time Output Enable Time Output Disable Time 5.0 5.0 5.0 5.0 5.0 5.0 1.0 1.0 1.0 1.0 1.0 1.0 Max 9.0 9.0 8.5 9.5 9.5 10 74ACT TA = -40C to +85C CL = 50 pF Min 1.0 1.0 1.0 1.0 1.0 1.0 Max 10 10 9.5 10.5 10.5 10.5 ns ns ns ns ns ns Unit
Output Disable Time *Voltage Range 5.0 V is 5.0 V 0.5 V.
CAPACITANCE
Symbol CIN CPD Input Capacitance Power Dissipation Capacitance Parameter Value Typ 4.5 45 Unit pF pF Test Conditions VCC = 5.0 V VCC = 5.0 V
http://onsemi.com
4
MC74AC125, MC74ACT125
ORDERING INFORMATION
Device MC74AC125N MC74AC125NG MC74AC125D MC74AC125DG MC74AC125DR2 MC74AC125DR2G MC74AC125DTR2 MC74AC125DTR2G MC74AC125M MC74AC125MG MC74AC125MEL MC74AC125MELG MC74ACT125DR2 MC74ACT125DR2G MC74ACT125DTR2 MC74ACT125DTR2G MC74ACT125MEL MC74ACT125MELG MC74ACT125N MC74ACT125NG Package PDIP-14 PDIP-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* TSSOP-14* SOEIAJ-14 SOEIAJ-14 (Pb-Free) SOEIAJ-14 SOEIAJ-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) TSSOP-14* TSSOP-14* SOEIAJ-14 SOEIAJ-14 (Pb-Free) PDIP-14 PDIP-14 (Pb-Free) 25 Units / Rail 2000 / Tape & Reel 2500 / Tape & Reel 2000 / Tape & Reel 50 Units / Rail 2500 / Tape & Reel 55 Units / Rail 25 Units / Rail Shipping
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free.
MARKING DIAGRAMS
PDIP-14 14 MC74AC125N AWLYYWWG 1 1 14 ACT125G AWLYWW 1 1 14 AC125G AWLYWW 1 14 SOIC-14 14 TSSOP-14 14 AC 125 ALYWG G 1 14 ACT 125 ALYWG G 1 74ACT125 ALYWG 74AC125 ALYWG SOEIAJ-14
A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week G or G = Pb-Free Package (Note: Microdot may be in either location)
http://onsemi.com
5
MC74AC125, MC74ACT125
PACKAGE DIMENSIONS
PDIP-14 CASE 646-06 ISSUE P
14
8
B
1 7
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 --- 10 _ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 --- 10 _ 0.38 1.01
A F N -T-
SEATING PLANE
L C
H
G
D 14 PL
K
M
J M
DIM A B C D F G H J K L M N
0.13 (0.005)
http://onsemi.com
6
MC74AC125, MC74ACT125
PACKAGE DIMENSIONS
SOIC-14 CASE 751A-03 ISSUE H
-A-
14 8
-B-
P 7 PL 0.25 (0.010)
M
B
M
1
7
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
G C -T-
SEATING PLANE
R X 45 _
F
D 14 PL 0.25 (0.010)
K
M
M
S
J
TB
A
S
DIM A B C D F G J K M P R
MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50
INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019
SOLDERING FOOTPRINT*
7X
7.04 1 0.58
14X
14X
1.52
1.27 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
MC74AC125, MC74ACT125
PACKAGE DIMENSIONS
TSSOP-14 CASE 948G-01 ISSUE B
14X K REF
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V N
S
2X
L/2
14
8
0.25 (0.010) M
L
PIN 1 IDENT. 1 7
B -U-
N F DETAIL E K
0.15 (0.006) T U
S
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
J J1
SECTION N-N -W-
C 0.10 (0.004) -T- SEATING
PLANE
D
G
H
DETAIL E
SOLDERING FOOTPRINT*
7.06 1
0.36
14X
14X
1.26
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
8
CCC EEE CCC EEE CCC
A -V-
K1
0.65 PITCH
DIMENSIONS: MILLIMETERS
MC74AC125, MC74ACT125
PACKAGE DIMENSIONS
SOEIAJ-14 CASE 965-01 ISSUE A
14
8
LE Q1 E HE M_ L DETAIL P
1
7
Z D e A VIEW P
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 1.42 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.056
c
b 0.13 (0.005)
M
A1 0.10 (0.004)
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
http://onsemi.com
9
MC74AC125/D

▲Up To Search▲

Price & Availability of MC74AC125DTR2G

	To Download MC74AC125DTR2G Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .